Everything changes. Everything inevitably evolves. Because of this reality, today’s industries must match the pace of modern and upcoming innovations. The PCB industry is no exception to this standard expectation. Without a doubt, the space that present-day PCB technology occupies is 1) widely vast and 2) increasingly dynamic.
The use of via-in-pad (VIP) technology for printed circuit boards has only grown due to the development of modern electronic products and their wide array of applications. Vias play a critical foundational role in interconnectivity between the layers of a PCB. This influential technique comes in handy in complex and multi-plated layouts. Let’s take a closer look at the top three advantages of using via-in-pad for PCB design to transform the digital world.
Space-Saving: Increase PCB Density
Vias come in several conventional categories depending on their functionality: through-hole vias, buried vias, or blind vias. The type of via a designer chooses to employ in their layout depends upon circuitry requirements, fabrication costs, and PCB technology. VIP technology is essentially a specialized through-hole technique, which places vias directly underneath the component contact pad.
Traditional PCB routing techniques don’t efficiently support the increasing request for the miniaturization of PCB chips. Via-in-pad does. The position of the vias on the mount surface pad is unique. However, the tactic prevents manufacturing issues for more complex projects. In designs where space is a constraint, you can’t go wrong with VIP to increase density and preserve desired performance.
Enhanced Thermal Dissipation
Choosing via-in-pad technology for your design does add extra capping steps to the fabrication process. That being said, its overall efficiency is well worth the costs for an intricate design project. Keep in mind how high power surface components traditionally have mounted thermal pads. VIP offers a perk in this situation over traditional routing styles.
Via components supplementarily support heat management within these thermal pads. When you drop in the vias from one side of the PCB to another, the copper area increases. This spacing design technique releases heat more efficiently through the board.
Boost Via Voltage and Performance Capability
Increasing a via’s voltage capability is the final benefit of the top three advantages of using via-in-pad for PCB design. All vias have inductance and resistance properties, which affect current flow. These complex variables are detrimental to PCB functionality. The design of capped via-in-pads enables shorter paths to power and comprehensively heightens the printed circuit board’s performance.
Look no further than Advanced Assembly for reliable turnkey PCB manufacturing. As expert PCB assemblers, we know that a smooth assembly process involves everyone working better together. We deliver personal service experiences to save you invaluable time and money and get high-quality PCBs back in hand as soon as possible. Feel free to reach out with any questions about our PCB manufacturing services and routing capabilities, or start a quote with us today.
