Printed circuit boards are intricately layered sandwich structures. Within these complex boards of electronic components and pathways lies ICs. IC packaging—aka integrated circuit packaging—refers directly to the material that contains a semiconductor device. This critical casing surrounds the circuit material on a PCB as protection against physical damage or corrosion.
Numerous types of integrated circuit packages exist on the market. Let’s examine closer their varied mountings and specialized applications. Here’s what to know about the four most common types of IC packaging and choosing the right one.
IC Packaging: Two Basic Categories
Integrated circuit packaging is the final stage of the production process for semiconductor devices. During this processing stage, technicians cover the semiconductor block with protection against external elements or corrosion with age. This encasement comes in varying designs to protect the block and circuit pathways of an electronic device’s PCB.
A slew of IC packaging technology options is available for different types of interconnections. Deciding which one is right for your project depends on size, assembly scale, component density, compatibility, and cost.
Through-Hole Mount IC Packages
Through-hole mounting IC packaging is a straightforward style. Consider the following through-hole package sub-types for the most cost-effective PCB design.
Dual In-Line Package
DIP packages are popular styles for two rows of pins arranged in a dual or parallel order. The housing is typically rectangular but can differ to fit varied sizes or internal architectures. These types of packages come in handy for PCB prototypes.
Standard or Shrink Package
Standard is easily the most common and relied-upon IC packaging for PCB assembly. Pin spacing is about 0.1 inches apart. If you need a smaller through-hole IC mounting package, shrink packages are a good alternative that is similar to standard ones. Their size is ideal for high-pin density packaging.
Surface Mount Technology IC Packages
Surface mount devices are more compact and costly compared to through-hole packaging options. Their compact size is ideal for larger circuits on a smaller PCB. Keep in mind that there is no hole-drilling to solder pins. IC packaging involves precise picking and placing of components on one side of a PCB. Manufactures achieve SMT IC packaging with two traditional sub-types.
L-Shaped Lead Package
This IC package type is best for SMT boards with L-shaped pins. The leads extend vertically downward from component housing, with an extended right angle parallel to the PCB. This distinctive L-shape eases the assembly process.
BGA: Ball Grid Array Package
BGA is a chip-carrying surface-mount package type that is mainly seen in computer equipment. This IC packaging is unique because the entire BGA surface can mount onto a PCB to connect directly with the circuit.
As you can see, an engineer has several IC options to consider for functional PCB design. For reliable quick-turn printed circuit boards, you can turn to Advanced Assembly to complete your project. Our operational capacity and design flexibility can get your product done fast and right. Contact us about our services or to start a quote today.
