3D X-Ray inspection is a widely accepted method for ensuring high-quality PCB assembly, most particularly on BGAs and other leadless components such as DFNs and QFNs. By analyzing hidden solder joints, 3D X-Ray inspection can detect a multitude of processing problems including solder joint shorts, opens and voids. Some defects such as bridges can be “seen” directly, while others can be detected using defined test criteria for a top-down view.
Advanced Assembly uses the 3D X-Ray machine to verify quality to ensure the highest quality assembly work and save customers thousands of dollars in frustrating debugging diagnostics.
Please watch the brief video below for more details on our 3D X-Ray capabilities.